
DL360 Gen10 6256 Kit
€2280,92
DL360 Gen10 6256 Kit
Availability: In stock
Secure payment · Fast delivery
EAN:W128495230Categories:, , Brand:
DL360 Gen10 6256 Kit
Specifications
Specifications
| Features | Market segment Server Maximum number of PCI Express lanes 48 PCI Express slots version 3.0 Scalability S4S |
| Market segment | Server |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Discrete graphics card | No |
| Discrete graphics card model | Not available |
| On-board graphics card | No |
| On-board graphics card model | Not available |
| ECC | Yes |
| Maximum internal memory supported by processor | 1 TB |
| Memory channels | Hexa-channel |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory types supported by processor | DDR4-SDRAM |
| Box | No |
| Component for | Server/workstation |
| Cooler included | No |
| Package type | Tray |
| Processor base frequency | 3,6 GHz |
| Processor boost frequency | 4,5 GHz |
| Processor cache | 33 MB |
| Processor cache type | L3 |
| Processor codename | Cascade Lake |
| Processor cores | 12 |
| Processor family | Intel® Xeon® Gold |
| Processor frequency | 3,6 GHz |
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor lithography | 14 nm |
| Processor manufacturer | Intel |
| Processor model | 6256 |
| Processor operating modes | 64-bit |
| Processor socket | LGA 3647 (Socket P) |
| Processor threads | 24 |
| System bus rate | 10,4 GT/s |
| Thermal Design Power (TDP) | 205 W |
| Vendor information | Brand Name Hewlett Packard Enterprise Warranty 1 År |
| Brand Name Hewlett Packard Enterprise | Warranty 1 År |
| Brand Name | Hewlett Packard Enterprise |
| Warranty | 1 År |
| Hovedkategori | Server, Computer & Printer Parts |
| Underkategori | CPUs |
Follow Us
We make consolidating, marketing and tracking your social media website easy.
Sign Up To Newsletter
Join 60.000+ subscribers and get a new discount coupon on every Saturday.

Add a review
Your email address will not be published. Required fields are marked *