
StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste
StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste, Thermal paste, 1.93 W/m·K, Silver, 0.12 °C/W, 1.7 g/cm³, -30 - 180 °C
Availability: In stock
StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste. Type: Thermal paste, Thermal conductivity: 1.93 W/m·K, Product colour: Silver. Width: 20 mm, Depth: 67 mm, Weight: 4 g. Package width: 84 mm, Package depth: 151 mm, Package height: 25 mm. Master (outer) case width: 330 mm, Master (outer) case length: 430 mm, Master (outer) case height: 330 mm
Specifications
| Type | Thermal paste |
| Thermal conductivity | 1.93 W/m·K |
| Product colour | Silver |
| Thermal resistance | 0.12 °C/W |
| Specific gravity | 1.7 g/cm³ |
| Operating temperature (T-T) | -30 - 180 °C |
| Evaporation (@ 200°C/24h) | 0.001% |
| Bleed (@ 200°C/24h) | 0.05% |
| Compliance certificates | RoHS |
| Width | 20 mm |
| Depth | 67 mm |
| Weight | 4 g |
| Package width | 84 mm |
| Package depth | 151 mm |
| Package height | 25 mm |
| Package weight | 17 g |
| Master (outer) case width | 330 mm |
| Master (outer) case length | 430 mm |
| Master (outer) case height | 330 mm |
| Products per master (outer) case | 230 pc(s) |
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